Heat pipe heat sinks

We have developed the "POWERKICKER" for cooling mass power semiconductors. This device is suitable for cooling relative mass thyristors, diodes, and power modules. In addition, "POWERKICKER E" is available for cooling semiconductors in vehicle inverter control apparatuses. Furthermore, we have developed "POWERKICKER L" for cooling IGBTs. In addition "POWERKICKER" for cooling power transistors is widely used to cool transistors.

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Thermal - Brazed aluminium heat sinks

Aluminium is easy to work, transmits heat well, is unlikely to corrode, and is light. Due to these characteristics, aluminium is one of the optimal materials for cooling systems. "Brazed aluminium heat sinks" manufactured by means of aluminium brazing have significantly reduced the thickness of fins, in contrast to those manufactured using conventional aluminium extrusion. Furthermore, the small inter-finn pitch of these heat sinks serves to realize compact cooling systems, and combination wit forced air cooling or heat pipes provides even better thermal conductivity characteristics.

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Crimped Fin Heat Sinks

Products we have recently developed include Pera-Flex, the worlds thinnest heat sink, and high-performance, heat-radiating crimped fins for cooling MPU's (micro processor units).

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Micro heat pipe heat sinks

Due to continuous efforts to compactify and integrate electronics, heat removal from semiconductor devices is a critical issue. Furukawa Electric has developed advanced cooling technologies as a pioneer of heat pipes called "super conductor for heat". By improving these heat pipes, we have devloped the micro heat pipe heat sink "HP-HS" as state-of-the-art cooling devices. As a result, we have obtained an 80% share of the global market for cooling devices for the microprocessors that are the core of the notebook computers, and the "HP-HS" is highly evaluated globally. furthermore, micro heat pipe of thickness 1mm have just joined the lineup (the current versions are 3 to 4mm diameter). Furukawa Electric is constantly taking the initiative in cooling technology.

More details available on www.furukawa.co.jp