What is UV Tape ?
UV Tape is adhesive tape for semiconductor process. It is suitable to protect surface of semiconductor wafer during backgrinding process, and to hold semiconductor wafer with ring frame during dicing process.
It is also applicable for various workpieces such as ceramics, glass, sapphire and so on.
What is mechanism of UV cure reaction?
UV tape includes these materials:
- Base Polymer
- Photo initiator
Structure before UV Irradiation
Only base polymer has polymerization structure. Oligomer is not reacted yet, and it has a fluidity. Due to the fluidity, it’s a strong adhesion before UV irradiation.
Structure after UV Irradiation
With UV irradiation, oligomers make cross -linked structure by the polymerization reaction.
Therefore, Adhesive becomes hard and loses adhesive strength.
UV Tape Product Ranges
Tape for Backgrinding
Tape for Dicing
Dicing Die Attach Film
What kind of UV wave length is required for UV tape?
Continuous 250~360nm wave length is required for cure reaction of UV-Tape.
Metal-halide Lamp (Recommended)
Main wave length is 365nm.
However that, this lamp also have 250~450nm wave length, widely.
Too many UV irradiation is not recommended because UV tape is affected by the head in the UV machine.
High Pressure Mercury Lamp (Recommended)
Main wave length is 365nm same as Metal-halide lamp. Others efficient wave length are 254nm, 303nm, 405nm and 436nm.
Peak wave length is 360nm and its range is 300~400nm.
On the other hand, black light is fluorescent light, hence illumination intensity is lower than other lamp.
Difference in Wavelength of Each UV Lamps
High Pressure Mercury Lamp
The most suitable UV condition for UV-TAPE?
The most suitable UV condition for UV-TAPE differ by tape grade, kind of UV lamp, and wafer surface conditions.
Regarding our UV-TAPE, recommendation UV irradiation is mentioned in our data sheet. Please examine the most suitable irradiation condition referring to them.
UV irradiation can be calculated by as follows:
Dosage of UV（mJ/cm2）=Illumination（mW/cm2） x time (sec.)
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