Dicing Die Attach Film

Die Attach Film is adhesive film which is used for semiconductor process. It is combined with dicing tape, and it is called as Dicing Die Attach Film.

Features

Optimized dicing tape for Die Attach Film achieves excellent pick up performance
Applicable dicing process is not only blade and also stealth laser dicing
Conductive Die Attach Film is also available
About Conductive Dicing Die Attach Film

Characteristics (Main Products)

			AFN603	AFN303	AFN601
Curing Condition^(note)			150deg.C, 60min Or 180deg.C, 60min	150deg.C, 60min	150deg.C, 60min Or 120deg.C, 60min(Half Cure)
Ramp UP Time to Curing Temperature			30min	30min	30min
DAF thickness		µm	20/25/50	10	50/60/80
General DC tape Type			UV type	UV type	UV type
DC tape thickness		µm	100	100	100
Recommended UV dosage		mJ/cm²	200	200	200
CTE	αlpha1	ppm/K	37	33	26
CTE	αlpha2	ppm/K	132	125	80
Tg (TMA)		deg.C	115	120	156
Metling Viscosity	70deg.C	Pa･s	37400	25000	16000
Metling Viscosity	120deg.C	Pa･s	2000	1350	1600
Elastic Modulus	50deg.C	MPa	2900	4500	6000
Elastic Modulus	250deg.C	MPa	56	100	650
Water Absorption, 85℃, 85%, 100h		wt%	0.8	0.8	0.7
Die Shear Strength 2x2mm Si Die to Si Mirror Wafer	@Room Temperature	MPa	60	60	50
Die Shear Strength 2x2mm Si Die to Si Mirror Wafer	@260deg.C	MPa	12	12	16

(note) When die attach void is happened, step curing (120deg.C, 60min + 150deg.C, 60min) is recommended

Basic Specifications

Standard specifications for AFN603, AFN303, and AFN601 are shown in below table.

Item	Standard Specifications
Number of Sheet in a roll	50pcs or 200pcs
Recommended Storage Condition	-5deg.C～10deg.C
Shelf Life	One Year after Production Date
Pot life	One Month after Thawing Date

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Introduction to Other Products

Furukawa Electric products are suited to a variety of applications.
We will introduce much suitable tape to your process, Just inform us device/application and specification.