Tape for Backgrinding

This is protection tape for circuit of semiconductor wafer surface in back grinding process.

Features

Suitable for thin wafer grinding caused by stress relaxation
Good for detaping
Suitable for various device

Tape for Backgrinding

Tape	SP Series	CP Series
Features	UV Type	Non-UV Type
Release Film	PET	PET Polypropylene
Adhesive	Acrylic	Acrylic
Backing Film	Polyolefin	Polyolefin

Characteristics (Main Products)

SP Series for silicon wafers

Tape			SP-594M- 130	SP5156B- 130	SP-541B- 205	SP-537T- 230	SP5207M- 425
Backing Film Thickness (µm)			100	110	165	100	420
Adhesive Thickness (µm)			30	20	40	130	5
Adhesive Strength (N/25mm)	♯280-SUS	Before UV	7.9	1.3	2.6	6.4	0.4
	♯280-SUS	After UV	0.1	0.3	0.5	0.8	0.3
	Si-Wafer	Before UV	3.0	0.5	1.7	2.5	0.2
	Si-Wafer	After UV	0.1	0.1	0.2	0.1	0.1
Features			Suitable for thin wafer Suitable for etching UV Type	Suitable for thin wafer Less warpage Easier detaping strength UV Type	Suitable for thin wafer Less warpage UV Type	Coverage up to 60μm UV Type	Coverage up to 250μm UV Type

(note) Data shown above are typical values and not guaranteed values.

CP Series for silicon wafers

Tape		CP9007B-130	CP9003B-205B	CP9079B-200	CP9206M-430
Backing Film Thickness (µm)		100	165	165	420
Adhesive Thickness (µm)		30	40	35	10
Adhesive Strength (N/25mm)	♯280- SUS	0.9	1.8	0.5	0.3
Features		Non-UV Type	Coverage up to 20μm Suitable for thin wafer Acid etching Non-UV Type	Silicone Free Release Film Non-UV Type	Coverage up to 250μm Non-UV Type

(note) Data shown above are typical values and not guaranteed values.

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Introduction to Other Products

Furukawa Electric products are suited to a variety of applications.
We will introduce much suitable tape to your process, Just inform us device/application and specification.