Tape for Dicing

This tape is used to hold semiconductor wafer during dicing/singulation process.

Features

Strong Adhesion before UV Irradiation
Easy Peel-off after UV Irradiation
Various Line-up for Special Application such as Glass, Wafer with Metal etc…

Tape for Dicing

Tape	Wafer Dicing UC Series	Package Dicing FC Series
Features	UV Type	UV Type
Release Film	PET	PET
Adhesive	Acrylic	Acrylic
Backing Film	Polyolefin	Polyolefin

Tape	Wafer Dicing UC Series	Package Dicing FC Series
Features	UV Type	UV Type
Release Film	PET	PET
Adhesive	Acrylic	Acrylic
Backing Film	Polyolefin	Polyolefin

Characteristics (Main Products)

UC Series for Compound wafer

Tape			UC3044M-110E	UC3044M-110B	UC3139M-85	UC-334EP-85
Backing Film Thickness (µm)			100	100	80	80
Adhesive Thickness (µm)			10	10	5	5
Adhesive Strength (N/25mm)	♯280-SUS	Before UV	5.1	2.5	4.9	1.5
	♯280-SUS	After UV	0.3	0.2	0.5	0.3
	Si-Wafer	Before UV	1.8	1.1	2.2	1.1
	Si-Wafer	After UV	0.1	0.1	0.1	0.2
Features			Less chipping	Less chipping	Suitable for thin wafers	Suitable for back side metal

(note) Data shown above are typical values and not guaranteed values.

FC Series for Package Dicing

Tape			FC2127M-165	FC-224M-170	FS-8304-170
Backing Film Thickness (µm)			150	150	150
Adhesive Thickness (µm)			15	20	20
Adhesive Strength (N/25mm)	♯280-SUS	Before UV	8.3	6.1	4.9
	♯280-SUS	After UV	0.7	0.4	0.5
	Si-Wafer	Before UV	8.9	5.2	5.5
	Si-Wafer	After UV	0.5	0.3	0.3
Features			Suitable for small-sized package	Less/no whisker	Antistatic

(note) Data shown above are typical values and not guaranteed values.

View Our Product Brochure

Introduction to Other Products

Furukawa Electric products are suited to a variety of applications.
We will introduce much suitable tape to your process, Just inform us device/application and specification.